Tel: +86 755 23001358 +852 60666694
E-mail:kefu@honorsing.com
SZ Add: H2206 Liuhe Building, No.168 Shenshan Road, Pingshan District, Shenzhen.
HK Add: Rooms 1318-19, 13/F, Hollywood Plaza, 610 Nathan Road, Mongkok, Hong Kong.
Features:
• Consistent diameter
• The stability when temperature change
• Extremely clean surface of the wire
• Excellent bonding reliability and good loop profile.
• Highest reliability in bonding connections and loop formation
The bonding wire including gold, silver wire, Applied to connect the chip and the lead frame in LED package filed.
• Low price
• Excellent conductivity and thermal performance
• High stiffness and suitable for fine lead bonding
• Excellent bonding reliability
Typical Properties:
Diameter: 0.018-0.050mm
Breaking load cN: >3.50->30.0
Elongation% : 4.50-15.0 to 10.0- 26.0