HonorSing Advanced Materials Limited
Tel: +86 755 23001358 +852 60666694
E-mail:kefu@honorsing.com
SZ Add: H2206 Liuhe Building, No.168 Shenshan Road, Pingshan District, Shenzhen.
HK Add: Rooms 1318-19, 13/F, Hollywood Plaza, 610 Nathan Road, Mongkok, Hong Kong.
Tel: +86 755 23001358 +852 60666694
E-mail:kefu@honorsing.com
SZ Add: H2206 Liuhe Building, No.168 Shenshan Road, Pingshan District, Shenzhen.
HK Add: Rooms 1318-19, 13/F, Hollywood Plaza, 610 Nathan Road, Mongkok, Hong Kong.
Thermal Paste
Detail:
Thermal putty
| • | High thermal conductivity with low thermal resistance |
| • | "Play-doh" like property, best used where large tolerance differences create |
| • | The need for compression of interface material beyond 50% of its original thickness |
| • | Low stress on the components naturally tacky and requires no further adhesive coating, which would inhibit thermal |
| performance |
|
| • | Room temperature storage |
| • | No “cure” required |
| • | UL Certification |
THERMAL PUTTY TG-500 PROPERTIES OVERVIEW
| TG-500 | Thermal
conductivity (W/m⋅K) |
Viscosity (cps) |
Density
(g/cm3) |
Hardness (Shore00) |
Weight Loss (%) |
| TG-500 | 1.0 |
> 4,000,000 |
2.50 |
5 |
≤0.2 |
| TG-510 | 1.2 |
> 4,000,000 |
2.50 |
5 |
≤0.2 |
| TG-520 | 2.0 |
> 4,000,000 |
2.65 |
5 |
≤0.2 |
| TG-530 | 3.0 |
> 4,000,000 |
2.80 |
5 |
≤0.2 |
| TG-540 | 4.0 |
> 4,000,000 |
3.00 |
5 |
≤0.2 |
| TG-550 | 5.0 |
> 4,000,000 |
3.20 |
5 |
≤0.2 |
TG-500 Series UL certification
TG-500 series thermally conductive putty can be used to fill into the power adaptor, power module and conduct the heat from circuits to the housing. TG-500 series thermal putty is with high thixtropic property, "Play-doh" like property, naturally tacky and requires no further adhesive coating. It can be storaged with room-temperature. TG-500 series thermally conductive putty will not cured in appliations.