Tel: +86 755 23001358 +852 60666694
E-mail:kefu@honorsing.com
SZ Add: H2206 Liuhe Building, No.168 Shenshan Road, Pingshan District, Shenzhen.
HK Add: Rooms 1318-19, 13/F, Hollywood Plaza, 610 Nathan Road, Mongkok, Hong Kong.
Features:
• Addition, heat cure type allows quick and low shrinkage cure
• Capable in large area adhesion
• Strong structure bond; excellent adhesion to most substrates
• Non-corrosive to metals; low odor cure
• Low volatility; reduced low-molecular siloxane content
• Excellent thermal performance
TC-9110 is a heat curing thermal conductive adhesive with thermal conductivity of 1.0W/m*K(ASTM D5470), the adhesion will be 13.5kg/cm2 when curing completely under heating condition. TC9110 have long term stable quality and can work continuesly in temperature of -50°C to 200°C without degradtion in adhesive and thermal conductivity.
When used in HCPV solar battery module, TC-9110 is coated in the interfaces between photoelectric conversion modules and the back panel.
TC-9100 PROPERTIES OVERVIEW
| TC-9100 | Thermal conductivity (W/m⋅K) |
Hardness |
Viscosity (cps) |
Density (g/cm3) |
Adhesive strength (N/cm2) |
Heat cure time (min) |
1.0±0.1 |
30±5 |
Semi-flowable |
1.88±0.05 |
130 |
80@120°C |
|
1.5±0.1 |
40±5 |
Non-flowable |
2.70±0.05 |
130 |
80@120°C |
|
3.0±0.1 |
65±5 |
Non-flowable |
2.90±0.05 |
110 |
80@120°C |