HonorSing Advanced Materials Limited
Tel: +86 755 23001358 +852 60666694
E-mail:kefu@honorsing.com
SZ Add: H2206 Liuhe Building, No.168 Shenshan Road, Pingshan District, Shenzhen.
HK Add: Rooms 1318-19, 13/F, Hollywood Plaza, 610 Nathan Road, Mongkok, Hong Kong.
Thermal Pad


Detail:

Thermal Pads (TP-200 series UL certification)
• TP-200 series with UL certification
• High thermal conductivity and low thermal impedence
• Ultra soft, highly conformable
• Puncture, shear and tear resistant, easily workable
• Designed for low-stress application


THERMALLY CONDUCTIVE PADS PROPERTIES OVERVIEW

TP 200 Series
/PF-970

Colour

Thermal
Conduc-tivity
(W/m
K)

Hard ness

Thick
ness
(mm)

Density
(g/cm3)

Dielectric
strength
(KV/mm)

Dielectric
constant
(MHz)

Volume
resis tivity
(
Ω⋅cm)

TP-215

Pink

1.50

75±5(Shore 00)

0.5--5.0

2.55

≥12

8.50

≥2.0x1014

TP-215_US

Pink

1.50

45±5(Shore 00)

0.5--5.0

2.55

≥12

8.50

≥2.0x1014

TP-215-HT

Gray

1.50

55±5(Shore A)

0.5--5.0

2.55

≥12

8.50

≥2.0x1014

TP-220

Gray

2.0

75±5(Shore 00)

0.5--5.0

2.63

≥12

13.10

≥2.3x1014

TP-220_HT

Gray

2.0

40±5(Shore A)

0.5--5.0

2.63

≥12

13.10

≥2.3x1014

TP-230

Light Blue

3.0

70±5(Shore 00)

0.5--5.0

2.80

≥14

11.60

≥3.1x1014

TP-230_HT

Gray

3.0

60±5(Shore A)

0.5--5.0

2.80

≥14

11.60

≥3.0x1014

TP-240

Dark Blue

4.0

80±5(Shore 00)

0.5--5.0

3.02

≥14

12.20

≥3.1x1014

TP-240_HT

Gray

4.0

25±5(Shore A)

0.5--5.0

3.02

≥14

12.20

≥3.3x1014

TP-250

Dark Gray

5.0

80±5(Shore 00)

0.5--5.0

3.10

≥14

14.40

≥3.3x1014

TP-250_HT

Gray

5.0

50±5(Shore A)

0.5--5.0

3.10

≥14

14.40

≥3.3x1014

TP-260

purple

6.0

50±5(Shore A)

0.5--5.0

3.20

≥14

15.00

≥3.3x1014

PF-970

Blue

7.0

40(Shore A)

0.5--5.0

1.40

≥10

5.40

≥3.3x1014

TP-200 series UL certification

TP-200 series of gap filling material is designed to strive for an excellent balance between the high thermal conductivity and low hardness. This series of material have a wide range of thermal conductivity to be chosen from. This material has very low silicone extractable levels and is suitable for telecom industry. Under moderate application pressure, TP-200 series of material can fill the air gaps between the hot components and their heat sinks, thus enhance the heat transfer. Pads are electrical non-conductive and is best suited for applications with pressure from 5 to 100 psi (0.03-0.69 MPa). Pad can be made with specific thickness and dimensions.

series of material are naturally tack on both sides of material, eliminate the need for thermally-impeding adhesive layers and facilitates the assembling process. Pads are supplied with protective liners on both sides.