High thermal conductivity, low thermal resistance;
Addition reaction, no volume change occurs during the curing process;
Has high thixotropy and can be uniformly filled into gaps of different thicknesses under low pressure;
Fast curing at room temperature or high temperature, 100% solid, no exudate after curing;
Superior resistance to high and low temperatures, weather, aging, and electrical insulation;
Superior chemical and mechanical stability;
Passed UL94V-0 flame retardant certification and RoHS hazardous standard verification.
One component thermal conductive silicone sealant, which may also be regarded as a heat curing thermal conductive gel, is a perfect combination of high thermal conductivity and low thermal resistance. Before curing, it is in the form of extrudable paste with good thixotropy, and can be used for manual or automatic dispensing operations. Under the high temperature of 80 ° C to 150 ° C, it can quickly solidify into an adhesive gel shape, fill in the gap between the heating device and the radiator, and stick to the contact surface between the heating device and the radiator, which has a lower contact thermal resistance than the ultra soft thermal conductive gasket. The solidified gel can maintain a certain thickness without collapse, and is completely free of oil seepage, with excellent aging resistance and stability. This product needs to be used up as soon as possible at room temperature. This product needs to be heated when used, and cured into soft gel under high temperature. The adhesive strength is not high, so it needs to be used with fasteners. At present, the thermal conductivity of the single component heat cured thermal conductive gel we provide ranges from 1.0 to 5.0W/m · K. The operation of the product is very similar to the super soft pad that can be dispensed. Customers can easily change the dispensing amount and dispensing route according to the application. The cured gel is sticky but has no bonding strength, which is easy to remove and replace.
Performance indicators of single component thermal conductive silicone sealant (heat cured)
| Product Name | Thermal conductivity (W/m · K) | Viscosity (cP) | Density (g/cm ²) | Curing time (min) | Hardness (Shore OO) |
| HTC-9110-T | 1.0 | 950000 to 350000 | 2.60 ± 0.20 | 60@150 °C | 35±25 |
| HTC-9120-T | 2.0 | 1125000 RMB 375000 RMB | 2.80 ± 0.20 | 60@150 °C | 35±25 |
| HTC-9130-T | 3.0 | 1125000 RMB 375000 RMB | 3.10±0.20 | 60@150 °C | 35±25 |
| HTC-9135-T | 3.5 | 1.1 million to 350000 | 3.20±0.30 | 60@150 °C | 35±25 |
| HTC-9140-T | 4.0 | 2 million to 1 million | 3.20±0.30 | 60@150 °C | 35±25 |
| HTC-9150-T | 5.0 | 2.5 million to 1 million | 3.40±0.30 | 60@150 °C | 40 to 30 |
