Application field
The company's product line focuses on electronic packaging materials, covering different packaging levels from level 0 to level 3 in electronic packaging, and meeting the needs of customers at all levels.
Zero level and first level packaging materials
First level packaging includes the entire process from wafer slicing to circuit testing, as well as various packaging materials such as reverse packing and epoxy molding plastics.
Debon's production of UV films, solid crystal materials, and other materials has broken the foreign technological monopoly, passed downstream key packaging and testing manufacturer certification, and supplied relevant customers in bulk, filling the gap in the field of high-end packaging materials in China. Plays an important role in solving the bottleneck problem of key material supply for national integrated circuit packaging.
Secondary packaging material
Secondary packaging refers to the installation of primary microelectronic packaging products, along with passive components, onto printed boards or other substrates to become components or complete machines. The installation techniques used at this level include through-hole mounting technology (THT), surface mount technology (SMT), and direct chip mounting technology (DCA).
Corresponding product applications are available to both domestic and international end customers, keeping up with the forefront of the times.
Intelligent terminal packaging materials
We provide packaging solutions for top customers in the field of smart wearables, and our complete product line is highly favored by customers.
Applied to electronic product terminals such as mobile phones, headphones, laptops, etc., it achieves functions such as bonding, optical transparency, side coating shading, heat dissipation, and filling protection.
Having core independent intellectual property rights.
Lithium battery packaging materials
The company's series of products, represented by new energy polyurethane structural adhesive, adopt innovative synthesis technology to achieve a new technological trend of lightweight, high energy density, and high reliability performance for power batteries, and provide key packaging materials for customers.
Serving top global customers in the power battery industry, our technological level and innovative iteration capability are at the forefront of the industry.
Photovoltaic module packaging materials
As a representative of advanced packaging technology, the company's photovoltaic stacked crystal materials can achieve high-density packaging for the industry, greatly improving component power for stacked tile technology.
The company collaborates with top clients in the photovoltaic industry; Technology is at the forefront of the industry chain, with a leading market share.
High end equipment packaging materials
As a representative of advanced packaging technology, the company's high-end equipment packaging materials can achieve high-density packaging for the industry and improve production line efficiency for customers through automation.
The company collaborates with top clients in the high-end manufacturing industry; Technology is at the forefront of the industry chain, with a leading market share.
Product features








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