Category
SMT red adhesive
Consulting productConsulting product
SMT red adhesive
30ml patch red adhesive
SMT adhesive is a single component, fast curing epoxy adhesive used for the assembly of components on SMT process circuit boards
Fixed adhesive, also known as red glue, patch red glue, SMT red glue, etc.
Product Features
1. Single component, fast curing
2. Easy to operate, can be used for scraping or dispensing glue
3. Wide bonding range, high bonding strength, and resistance to high temperature impact
4. The product has high stability, long operation time, and long storage cycle
Consulting productConsulting product
Product Documentation
Product Documentation
Product Details
Main purpose:
1. Adhesive fixation of surface mount components in the power supply industry
2. Fixed bonding of electronic product positions
3. Four corner fixation of the chip
Product Parameters
| Product Code | color | chemical property | Viscosity (Pa-s) | fixed conditions | TG(℃) | Storage conditions |
| H6607 | red | epoxy resin | 10 | 120s@125 ℃ | 98 | 6mths@2-8 ℃ |
| H6608* | red | epoxy resin | 32 | 120s@125 ℃ | 110 | 6mths@2 ~8℃ |
| H6608 | red | epoxy resin | 32 | 120s@125 ℃ | 110 | 6mths@2-8 ℃ |
| H6610 | red | epoxy resin | 4 | 120s@120 ℃ | 86 | 6mths@2 ~8℃ |
| H6610B | black | epoxy resin | 4.5 | 60s@150 ℃ 180s@120 ℃ |
98 | 6mths@2-8 ℃ |
| H6620 | red | epoxy resin | 14 | 120s@125 ℃ | 98 | 6mths@2-8 ℃ |
| H6625 | red | epoxy resin | 14 | 120s@125 ℃ | 98 | 6mths@2-8 ℃ |
| H6626 | red | epoxy resin | 26 | 120s@120 ℃ | 113 | 6mths@2-8 ℃ |
| H6629 | red | epoxy resin | 26 | 60s@150 ℃ 120s@120 ℃ |
113 | 6mths@2-8 ℃ |
