DP-F2000 is a soft self-adhesive thermal pad filled with ceramic particles, with a thickness of 0.5-8.0mm to choose from. It has a thermal conductivity of 2.1W/m · K, a temperature resistance range of -50-200 ℃, and UL94 V0 fire resistance. It can be filled with rough surfaces under low pressure without the need for additional adhesive, and is suitable for various electronic device heat dissipation needs
Core strengths
【 Soft and low resistance, strong adhesion 】 45 Shore00 has soft characteristics, with a deformation of 42% under 60psi pressure. It can tightly adhere to irregular rough surfaces at low pressure, eliminating air gaps. The thermal resistance is as low as 0.60 ℃· in ²/W (40mil/20psi), and the heat transfer efficiency is higher
【 Comes with self-adhesive coating, easy to install 】 No additional adhesive coating is required, the film can be peeled off to bond, simplifying the installation process while avoiding residual adhesive contamination of devices, suitable for automated assembly and manual installation scenarios
【 Wide temperature and weather resistance, safe and reliable 】 The working temperature covers -50-200 ℃, can withstand extreme high and low temperature environments, UL94 V0 fire certification, dielectric breakdown strength>250 VAC/mil, excellent insulation performance, safer to use
【 Multi specification adaptation, wide universality 】 The thickness of 0.5-8.0mm can be flexibly selected, with a tensile strength of 20psi and an elongation rate of 77%. It has good mechanical properties and can adapt to the gap filling and heat dissipation needs of different devices
Applicable scenarios
Core application devices/components
Industrial power supply: IGBT module, power tube, filling device and heat sink gap, low-pressure installation without damaging the device, suitable for high temperature working conditions
Communication base station: power amplifier module, optical module, self-adhesive feature for simplified assembly, wide temperature range suitable for outdoor extreme environments
Consumer electronics: routers, set-top boxes, filling gaps between PCB boards and heat dissipation shells, soft materials adhering to irregular surfaces
LED lighting: Lamp bead substrate and heat sink, fire certification for safer and more efficient heat dissipation of lamp beads, extending service life

Instructions for Use
1. Clean the surface and heat dissipation structure of the heating element with anhydrous ethanol, remove oil and dust, and air dry until there are no residues;
2. Confirm that the product thickness matches the installation gap, cut it to the required size as needed, and remove the protective film on the surface of the thermal pad;
3. Align the installation position with the thermal pad and lightly press it to ensure full contact between the thermal pad and the surface, ensuring no residual bubbles;
4. In conjunction with screw locking or buckle fixation, it is recommended to apply a pressure of 20-60psi to ensure a stable fit without the need for additional adhesive coating.
Precautions
Storage conditions: Sealed and stored in a cool and dry place (0-30 ℃), avoiding direct sunlight and high temperature and humidity environment. Shelf life is 12 months from the date of production
Usage taboos: Avoid contact with strong acids, bases, and organic solvents, and prohibit use in food contact scenarios and extreme vacuum environments
Thickness selection: Choose the appropriate thickness based on the installation gap, and it is recommended to reserve 10-20% compression to ensure the fitting effect
Customization Description: Supports cutting customization within the thickness range of 0.5-8.0mm, specific length and width dimensions and required thickness need to be provided
| technical indicators | specific numerical value | Test Standard |
| thermal conductivity | 2.1 W/m·K | ASTM D5470 |
| color | grey | visual inspection |
| Shore hardness | 45 Shore 00 | ASTM D2240 |
| tensile strength | 20 psi | ASTM D412 |
| Deformation @ 2mm, 60psi | 42% | ASTM D575 |
| Performance testing curve | |
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