Core strengths

【 High thermal conductivity efficiency, top-notch heat dissipation 】 The thermal conductivity coefficient can reach up to 4.0W/m · K, with a thickness of 40mil and a thermal resistance of only 0.45 ℃· in ²/W under 20psi pressure. High power devices can quickly dissipate heat, increasing heat dissipation efficiency by 50% compared to conventional products

Self adhesive design, easy installation: With built-in adhesive, no additional glue is required, the film can be peeled off and pasted, simplifying the assembly process and avoiding residual adhesive contamination of devices. It is compatible with automated production lines and manual installation, improving work efficiency

【 Soft and high elasticity, good filling performance 】 40 ± 5 Shore 00 soft characteristics, 2mm thickness, deformation of 45% under 60psi pressure, can seamlessly fill various rough surface gaps, eliminate air gaps, and significantly reduce contact thermal resistance

【 Wide temperature safety, stable and reliable 】 The working temperature covers -50-200 ℃, can withstand extreme high and low temperature environments, has UL94 V0 fire certification, has a volume resistance of 2 × 10 ¹³ ohm cm, excellent insulation performance, and is recommended to be stored at a temperature of 8-30 ℃. There is no risk of aging or failure during long-term use

Applicable scenarios

Core application devices/components

New energy vehicles: battery pack heat dissipation module, motor controller, on-board charger (OBC), high thermal conductivity efficiency suitable for high-power heat dissipation, self-adhesive characteristics simplify assembly, wide temperature tolerance to extreme on-board environments

Industrial electronics: IGBT modules for inverters and frequency converters, with soft and high deformation filling on rough surfaces. Low pressure installation does not damage precision components, ensuring long-term stable operation of equipment

High end consumer electronics: gaming laptop CPU/GPU, professional workstation, 4.0W/m · K high thermal conductivity for rapid cooling, avoiding lagging and crashing under high loads, self-adhesive design does not occupy installation space

Communication base station: high-power amplifier module, power supply unit, insulation and fire resistance characteristics meet the safety standards of base stations, wide temperature adaptability to outdoor temperature difference environments

Instructions for Use

1. Clean the surface and heat dissipation structure of the heating element with anhydrous ethanol, remove oil and dust, and air dry until there are no residues;

2. Confirm that the product thickness matches the installation gap, cut it to the required size as needed, and remove the protective film on the surface of the thermal pad;

3. Align the installation position with the thermal pad and lightly press it to ensure full contact between the thermal pad and the surface, ensuring no residual bubbles;

4. In conjunction with screw locking or buckle fixation, it is recommended to apply a pressure of 20-60psi to ensure a stable fit without the need for additional adhesive coating.

Precautions

Storage conditions: Sealed and stored in a cool and dry place (8-30 ℃), avoiding direct sunlight and high temperature and humidity environment. Shelf life is 12 months from the date of production

Usage taboos: Avoid contact with strong acids, bases, and organic solvents, and prohibit use in food contact scenarios and extreme vacuum environments

Thickness selection: Choose the appropriate thickness based on the installation gap, and it is recommended to reserve 10-20% compression to ensure the fitting effect

Customization Description: Supports cutting customization within the thickness range of 0.5-8.0mm, specific length and width dimensions and required thickness need to be provided