DP-F5000 is a ceramic particle filled silicone self-adhesive pad with a rose gold appearance and a thickness of 0.5-8mm to choose from. It has a thermal conductivity of 5.1W/m · K, a working temperature of -50-200 ℃, and UL94 V0 fire resistance. It is self-adhesive and easy to operate, suitable for rough surfaces of medium and high power equipment for heat dissipation
Core strengths
【 High thermal conductivity, low resistance, efficient heat dissipation 】 The thermal conductivity coefficient can reach up to 5.1W/m · K, with a thickness of 40mil and a thermal resistance of only 0.31 ℃· in ²/W under 10psi pressure. The heat conduction speed is fast, and the heat dissipation efficiency is improved by 60% compared to conventional products
Self adhesive design, easy installation: With built-in adhesive, no additional glue is required, and the film can be peeled off and pasted, simplifying the assembly process and avoiding residual adhesive contamination of devices. It is suitable for automated production and manual installation, improving work efficiency
【 Soft fitting, strong filling 】 50 Shore 00 soft properties, 2mm thickness, deformation of 25% under 20psi pressure, can fully fill various rough surface gaps, eliminate air gaps, and reduce contact thermal resistance
【 Safe and stable, with excellent weather resistance 】 The working temperature covers -50-200 ℃, and it can withstand extreme high and low temperature environments. It has UL94 V0 fire certification, dielectric breakdown strength>200VAC/mil, volume resistance 1 × 10 ¹³ ohm cm, and excellent insulation performance
Applicable scenarios
Core application devices/components
Industrial Electronics: Industrial power supply, IGBT modules for frequency converters, installation of low voltage and low resistance adaptation equipment, wide temperature characteristics, tolerance to workshop temperature differences
Communication equipment: router amplifier module, optical module, self-adhesive feature simplifies assembly, fills rough surfaces to improve heat dissipation consistency
Consumer electronics: laptops, game consoles, 5.1W high thermal conductivity to reduce core component temperature and avoid high load lag
Automotive electronics: car power module, resistant to high and low temperature fluctuations, self-adhesive installation does not occupy space, ensuring stable driving heat dissipation

Instructions for Use
1. Clean the surface and heat dissipation structure of the heating element with anhydrous ethanol, remove oil and dust, and air dry until there are no residues;
2. Confirm that the product thickness matches the installation gap, cut it to the required size as needed, and remove the protective film on the surface of the thermal pad;
3. Align the installation position with the thermal pad and lightly press it to ensure full contact between the thermal pad and the surface, ensuring no residual bubbles;
4. When using screws for locking or fastening, it is recommended to apply a pressure of 10-20 psi to ensure a stable fit without the need for additional adhesive.
Precautions
Storage conditions: Sealed and stored in a cool and dry place (8-28 ℃), avoiding direct sunlight and high temperature and humidity environment. Shelf life is 12 months from the date of production
Usage taboos: Avoid contact with strong acids, bases, and organic solvents, and prohibit use in food contact scenarios and extreme vacuum environments
Thickness selection: Choose the appropriate thickness based on the installation gap, and it is recommended to reserve 10-20% compression to ensure the fitting effect
Customization Description: Supports cutting customization within the thickness range of 0.5-8.0mm, specific length and width dimensions and required thickness need to be provided
| technical indicators | specific numerical value | Test Standard |
| thermal conductivity | 5.1 W/m·K | ASTM D5470 |
| color | rose gold | visual inspection |
| Shore hardness | 50 Shore 00 | ASTM D2240 |
| tensile strength | 9 psi | ASTM D412 |
| Deformation @ 2mm, 20psi | 25% | ASTM D575 |
| Performance testing curve | |
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