High thermal conductivity, low thermal resistance, low stress, low modulus;
Rubber like, with strong plasticity and good adhesion, suitable for complex environments with large variations in thickness requirements;
Squeezing thermal conductive paste has a certain viscosity, can be extruded, has good thixotropy, does not flow away, and has good adhesion with the contact surface. It can be used for automatic dispensing;
No need for curing, no deformation when no pressure is applied, good vibration resistance, easy to rework;
Superior resistance to high and low temperatures, weather, aging, and electrical insulation;
Passed UL94VO flame retardant certification and RoHS hazardous standard verification.
No need for curing, applied to fill gaps between large and irregular heating and cooling surfaces, requiring device fixation.
Thermal conductive mud is a thermal conductive material used in electronic devices, which has excellent thermal conductivity. Rubber like thermal conductive paste has a high viscosity and is harder than silicone grease. Users can pinch it into a certain shape according to their needs and fill it between the electronic components that need to be cooled and the heat sink/shell, making it tightly in contact and reducing thermal resistance. The thermal conductive paste can be squeezed into a paste shape with strong thixotropy and can be used with manual or automatic dispensing equipment. It will not deform without pressure or contact, effectively filling the small gaps between the contact surface of the heat sink and the heat sink, quickly and effectively conducting heat, thereby reducing the temperature of electronic components, extending the service life of electronic components, and improving their reliability. The TG-500 series thermal conductive mud does not crosslink, so it can be used in electronic assembly when the radiator needs to be modified or replaced. This product is easy to operate.
Performance indicators of rubber clay like thermal conductive paste
| Product Name | Thermal conductivity (W/m · K) | Density (g/cm ²) | state |
| HTG-510 | 1.0 | 2.60 ± 0.10 | Putty like substance |
| HTG-520 | 2.0 | 2.80 ± 0.20 | Putty like substance |
| HTG-530 | 3.0 | 3.10±0.20 | Putty like substance |
| HTG-540 | 4.0 | 3.30 ± 0.20 | Putty like substance |
| HTG-550 | 5.0 | 3.40±0.30 | Putty like substance |
| HTG-560 | 6.0 | 3.50±0.30 | Putty like substance |
| HTG-570 | 7.0 | 3.60±0.40 | Putty like substance |
| HTG-580 | 8.0 | 3.65±0.40 | Putty like substance |
| HTG-590 | 9.0 | 3.70±0.40 | Putty like substance |
Performance indicators of squeezable thermal conductive mud
| Product Name | Thermal conductivity (W/m · K) | Density (g/cm ²) | Viscosity (cP) |
| HTG-510-KJ | 1.0 | 2.60±0.10 | 950000 to 350000 |
| HTG-520-KJ | 2.0 | 2.80 ± 0.20 | 950000 to 450000 |
| HTG-530-KJ | 3.0 | 3.10±0.20 | 1.5 million to 500000 |
| HTG-540-KJ | 4.0 | 3.30±0.20 | 1.75 million to 750000 |
| HTG-550-N | 5.0 | 3.40±0.30 | 2.5 million to 500000 |
| HTG-560-KJ | 6.0 | 3.50±0.30 | 3 million to 1.5 million |
| HTG-570-KJ | 7.0 | 3.50±0.30 | 3.5 million to 1.5 million |
