Products
Two component thermal conductive silicone encapsulant (room temperature curing)

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Products
Two-component thermal gap-filler
Two-component thermal gap-filler
Two component thermal conductive silicone encapsulant (room temperature curing)
Two-component thermal gap-filler

High thermal conductivity, low thermal resistance;

Addition reaction, no volume change occurs during the curing process;

Has high thixotropy and can be uniformly filled into gaps of different thicknesses under low pressure;

Fast curing at room temperature or high temperature, 100% solid, no exudate after curing;

Superior resistance to high and low temperatures, weather, aging, and electrical insulation;

Superior chemical and mechanical stability;

Passed UL94V-0 flame retardant certification and RoHS hazardous standard verification.

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Product Documentation Product Documentation
Product Details

Two component thermal conductive silicone, cross-linked into a solid elastomer at room temperature, also known as gap filler, can be used as a heat source on PCB boards to fill irregular gaps between the surrounding chassis or heat sink. The adhesive enhancement formula of two-component thermal conductive silicone can provide both thermal conductivity and bonding functions for multiple materials simultaneously. At present, the thermal conductivity of the two-component thermal conductive silicone we provide ranges from 1.5 to 5.0 W/m · K. Easy to extrude and operate. After curing, it shows low hardness and low bonding strength. It can be used as a two-component room temperature curing thermal conductive gel, or as a two-component super soft pad that can be dispensed. The cured gel is not sticky, and is easy to remove and replace. 100% curing at room temperature without gas release during curing, can be accelerated by heating to improve production efficiency.

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Product Parameters
Performance indicators of two-component thermal conductive silicone sealant (room temperature curing)
Product Namemixing ratioThermal conductivity (W/m · K)Viscosity (cP)Density (g/cm ²)Hardness (Shore)
HTC-2151:11.51.5 million ± 4000002.62 ± 0.1045 ± 5 (A)
HTC-215-AD1:11.51.5 million ± 4000002.62 ± 0.1055 ±5(A)
HTC-2191:11.91.6 million ± 4000002.75 ± 0.1040 ± 5 (A)
HTC-219-AD1:11.91.6 million ± 4000002.75 ± 0.1055 ±5(A)
HTC-220-N1:12.0150000 ± 500002.00 ± 0.0555 ± 5 (OO)
HTC-2301:13.01.6 million ± 4000002.86 ± 0.1045 ± 5 (A)
HTC-235-T1:13.5650000 ± 2500002.95 ± 0.1050 ±10(OO)
HTC-2401:14.0350000 ± 1000003.20 ± 0.1050 ±10(OO)
HTC-2501:15.0650000 ± 2500003.30 ± 0.1050 ± 10 (OO)