Core strengths

【 Efficient thermal conductivity, extremely low thermal resistance 】 The thermal conductivity coefficient is as high as 8.0W/m · K, with a thickness of 2mm and a thermal resistance of only 0.31 ℃· in ²/W under 10psi pressure. High power devices can quickly dissipate heat, and the heat dissipation efficiency is improved by more than 100% compared to conventional products

【 Thickness adjustable hardness, strong adaptability 】 When the thickness is ≤ 1.5mm, the hardness is 70 ± 5 Shore 00, and when the thickness is>1.5mm, the hardness is 50 ± 10 Shore 00. The deformation of 2mm thickness and 20psi pressure can reach 38%, which can accurately adapt to different clearances and installation pressure requirements

Self adhesive design, easy to operate. It comes with adhesive without the need for additional coating, and can be applied immediately after tearing off the film, simplifying the assembly process and avoiding residual adhesive contamination of components. It is compatible with automated production lines and manual installation, improving work efficiency

【 Safe and stable, with excellent weather resistance 】 The working temperature covers -50-200 ℃, and it can withstand extreme high and low temperature environments. It has UL94 V0 fire certification, dielectric breakdown strength>5kV/mm, volume resistance>1 × 10 ¹³ ohm cm, and excellent insulation performance

Applicable scenarios

Core application devices/components

New energy vehicles: battery pack cooling module, motor controller, 8.0W high thermal conductivity suitable for high-power cooling, wide temperature characteristics resistant to extreme on-board environments

Industrial high-power electronics: inverters, IGBT power modules, adaptable to different installation clearances based on thickness and hardness, low-pressure installation without damaging precision components

High end servers: CPU/GPU core heat dissipation module, low thermal resistance for rapid cooling, ensuring stable operation of servers under high loads for a long time

Communication core equipment: high-power amplifier module, insulation and fire resistance characteristics meet equipment safety standards, self-adhesive design simplifies assembly process

Instructions for Use

1. Clean the surface and heat dissipation structure of the heating element with anhydrous ethanol, remove oil and dust, and air dry until there are no residues;

2. Confirm that the product thickness matches the installation gap, cut it to the required size as needed, and remove the protective film on the surface of the thermal pad;

3. Align the installation position with the thermal pad and lightly press it to ensure full contact between the thermal pad and the surface, ensuring no residual bubbles;

4. When using screws for locking or fastening, it is recommended to apply a pressure of 10-20 psi to ensure a stable fit without the need for additional adhesive.

Precautions

Storage conditions: Sealed and stored in a cool and dry place (8-28 ℃), avoiding direct sunlight and high temperature and humidity environment. Shelf life is 12 months from the date of production

Usage taboos: Avoid contact with strong acids, bases, and organic solvents, and prohibit use in food contact scenarios and extreme vacuum environments

Thickness selection: Choose the appropriate thickness based on the installation gap, and it is recommended to reserve 10-20% compression to ensure the fitting effect

Customization Description: Supports cutting customization within the thickness range of 0.5-8.0mm, specific length and width dimensions and required thickness need to be provided